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Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jun 26 - Jul 1
For Your Every Summer RSVP, with Code: SUMMER15
Description
2uul BH40 Middle Layer BGA Reballing Stencil Platform Set for iPhone 17 Series, 2uul BH401. Engineered specifically for mid layer BGA reballing on smartphone motherboards, ensuring accurate alignment and consistent solder joints. 2. Integrated magnetic structure securely holds chips and stencil in place, preventing displacement during heating and reflow. 3. Comes with matched stencil support for fast alignment and uniform solder ball planting, significantly improving workflow efficiency. 4. Manufactured with premium grade materials and


Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy




